Temperature control module using gas pressure to control...

Details Temperature control module using gas pressure to control... Temperature control module using gas pressure to control...

2008-10-31

2011-12-27

Lund, Jeffrie R (Department: 1716)

Coating apparatus

Gas or vapor deposition

With treating means

C118S725000, C118S7230ER, C118S715000, C118S728000, C156S245000, C156S245000, C156S245000, C156S245000, C156S345530

Reexamination Certificate

active

08083855

ABSTRACT:
A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric therewith, such that gas filled spaces surround the tubes. By flowing a heat transfer liquid in the tubes and adjusting the gas pressure in the spaces, localized temperature of the component body can be precisely controlled. One or more heating elements can be arranged in each zone and a heat transfer liquid can be passed through the tubes to effect heating or cooling of each zone by activating the heating elements and/or varying pressure of the gas in the spaces.

REFERENCES:
patent: 2440245 (1948-04-01), Chevigny
patent: 3189524 (1965-06-01), Hocker et al.
patent: 5228513 (1993-07-01), Hemsath
patent: 5248657 (1993-09-01), Bailey et al.
patent: 5294778 (1994-03-01), Carman et al.
patent: 5295822 (1994-03-01), Hemsath
patent: 5892207 (1999-04-01), Kawamura et al.
patent: 5900162 (1999-05-01), Kawahara et al.
patent: 6080970 (2000-06-01), Yoshida et al.
patent: 6147334 (2000-11-01), Hannigan
patent: 6508884 (2003-01-01), Kuibira et al.
patent: 6508885 (2003-01-01), Moslehi et al.
patent: 6610170 (2003-08-01), Tamura et al.
patent: 6730175 (2004-05-01), Yudovsky et al.
patent: 6847014 (2005-01-01), Benjamin et al.
patent: 7156951 (2007-01-01), Gao et al.
patent: 7161121 (2007-01-01), Steger
patent: 7554059 (2009-06-01), Awazu et al.
patent: 8012304 (2011-09-01), Brillhart et al.
patent: 2002/0002951 (2002-01-01), Kuznetsov
patent: 2002/0075624 (2002-06-01), Wang et al.
patent: 2004/0187787 (2004-09-01), Dawson et al.
patent: 2004/0261721 (2004-12-01), Steger
patent: 2005/0133160 (2005-06-01), Kennedy et al.
patent: 2005/0211385 (2005-09-01), Benjamin et al.
patent: 2005/0241765 (2005-11-01), Dhindsa et al.
patent: 2006/0144516 (2006-07-01), Ricci et al.
patent: 2007/0086144 (2007-04-01), Steger
patent: 2008/0023147 (2008-01-01), Yokogawa et al.
patent: 2009/0111276 (2009-04-01), Dhindsa et al.
patent: 2010/0078151 (2010-04-01), Koenigsberg et al.
patent: 2010/0122774 (2010-05-01), Makabe et al.
patent: 2010/0210115 (2010-08-01), Hara et al.
International Search Report and Written Opinion dated May 21, 2009 for PCT/US2008/012394.

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