Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2007-10-09
2007-10-09
MacArthur, Sylvia R. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C118S724000
Reexamination Certificate
active
10737397
ABSTRACT:
A temperature control assembly for use in etching processes includes a housing, a cooling conduit, fasteners, and a mounting block. The fasteners couple to the housing and operate to associate the cooling conduit, which is formed from a non-corrosive metallic material, with the housing. The mounting block is coupled to the cooling conduit. Also, a method for retrofitting an existing temperature control assembly includes removing an original cooling mechanism, selecting a retrofit cooling conduit formed from a non-corrosive metallic material, coupling fasteners to a housing of the temperature control assembly to associate the retrofit cooling conduit with the housing, and coupling a retrofit mounting block to the retrofit cooling conduit.
REFERENCES:
patent: 5345534 (1994-09-01), Najm et al.
patent: 5970214 (1999-10-01), Gat
patent: 6367410 (2002-04-01), Leahey et al.
patent: 6506291 (2003-01-01), Tsai et al.
patent: 6645344 (2003-11-01), Caldwell et al.
patent: 6984942 (2006-01-01), Siegfried et al.
patent: 2002/0174953 (2002-11-01), Yamada
patent: 2005/0126713 (2005-06-01), Kelley
“Applied Centura DPS Etch—DPS Plus for Metal Applications”, website http://www.appliedmaterials.com/products/metal—etch—dps—plus—centura.html, printed on Dec. 4, 2003, 1 page.
“Applied Centura DPS Etch—DPS II for Metal Applications”, website http://www.appliedmaterials.com/products/metal—etch—dps—ii—centura—300.html, printed on Dec. 4, 2003, 1 page.
“Applied Centura DPS Etch—DPS Plus for Silicon Applications”, website http://www.appliedmaterials.com/products/silicon—etch—dps—plus.html, printed on Dec. 4, 2003, 1 page.
“Applied Centura DPS Etch—DPS II for Silicon Applications”, website http://www.appliedmaterials.com/products/silicon—etch—dps—ii—300.html, printed on Dec. 4, 2003, 1 page.
“Applied Centura eMAX Etch”, website http://www.appliedmaterials.com/products/dielectric—etch—emax.html, printed on Dec. 4, 2003, 1 page.
“Applied Centura Enabler Etch”, website http://www.appliedmaterials.com/products/dielectric—etch—enabler.html, printed on Dec. 4, 2003, 1 page.
“Applied Centura EnTek Etch—for Dielectric Applications”, website http://www.appliedmaterials.com/products/dielectric—etch—emax—entek.html, printed on Dec. 4, 2003, 1 page.
“Applied Producer Etch”, website http://www.appliedmaterials.com/products/producer—etch.html, printed on Dec. 4, 2003, 1 page.
“Applied Centura HART Etch for Silicon Applications”, website http://www.appliedmaterials.com/products/silicon—etch—hart.html, printed on Dec. 4, 2003, 1 page.
Brady W. James
Keagy Rose Alyssa
MacArthur Sylvia R.
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