Temperature compensation for silicon MEMS resonator

Details Temperature compensation for silicon MEMS resonator Temperature compensation for silicon MEMS resonator

2006-01-17

2006-01-17

Callahan, Timothy P. (Department: 2816)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C333S197000, C333S219000

Reexamination Certificate

active

06987432

ABSTRACT:
Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.

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