Temperature coefficient of offset adjusted semiconductor device

Details Temperature coefficient of offset adjusted semiconductor device Temperature coefficient of offset adjusted semiconductor device

1997-09-03

1999-11-30

Picardat, Kevin M.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 50, 73720, 73726, H01L 2100

Patent

active

059941618

ABSTRACT:
A non-zero temperature coefficient of offset (Tco) in a semiconductor device (5) is adjusted by reducing the amount of adhesive material used to secure a first structure to a second structure. An adhesive layer (14) used to secure a sensor die (11) to a constraint die (12) in a pressure sensor application is reduced in thickness and/or formed so that adhesive material does not completely cover the constraint die (12). The Tco is further adjusted by reducing the amount and/or patterning the adhesive layer (18) used to secure the sensor (10) to its package (16).

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