Techniques to improve characteristics of processed...

Details Techniques to improve characteristics of processed... Techniques to improve characteristics of processed...

2008-11-10

2011-12-13

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S689000, C438S745000, C438S761000, C438S765000, C438S769000, C257SE21295

Reexamination Certificate

active

08076240

ABSTRACT:
Techniques to improve characteristics of processed semiconductor substrates are described, including cleaning a substrate using a preclean process, the substrate comprising a dielectric region and a conductive region, introducing a hydroquinone to the substrate after cleaning the substrate using the preclean operation, and forming a capping layer over the conductive region of the substrate after introducing the hydroquinone.

REFERENCES:
patent: 2002/0028505 (2002-03-01), Sakai et al.

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