Techniques for forming interconnects

Details Techniques for forming interconnects Techniques for forming interconnects

2007-10-31

2010-10-26

Davis, Robert B (Department: 1791)

Static molds

Including destructible feature

C249S062000, C249S115000, C249S134000

Reexamination Certificate

active

07819376

ABSTRACT:
A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.

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