Technique of increasing bond pad density on a semiconductor die

Details Technique of increasing bond pad density on a semiconductor die Technique of increasing bond pad density on a semiconductor die

1992-08-25

1994-04-05

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

437180, H01L 29400, H01L 21280

Patent

active

053008154

ABSTRACT:
A novel technique for increasing bond pad density is described whereby non-square bond pads are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith and are aligns to the approach angle of the conductive line to which it is connected. A variation on the inventive technique provides for alternating, interleaved, complementary wedge-shaped bond pads which provide for high bond pad density while accommodating a wide range of approach angles.

REFERENCES:
patent: 5091825 (1992-02-01), Hill et al.
Translation of De 29 42 394 to Usami et al. (May 1980) 15 pages, 257/786.

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