Technique for improving within-wafer non-uniformity of material

Details Technique for improving within-wafer non-uniformity of material Technique for improving within-wafer non-uniformity of material

1996-10-11

1998-03-03

Morgan, Eileen P.

Abrading

Abrading process

Glass or stone abrading

451 59, 451303, 451307, B24B 2100

Patent

active

057228779

ABSTRACT:
A platen ring for use with a platen on a linear polisher, in which the platen ring is used to reduce fluctuation of the belt/pad assembly as it encounters the platen. The platen ring is disposed around the platen so that a fluctuation of the belt/pad assembly is dampened before the belt/pad assembly engages the platen. Reduction of the belt/pad fluctuation ensures a reduction in the within-wafer non-uniformity and provides for a more uniform polishing rate across the surface of the wafer.

REFERENCES:
patent: 3753269 (1973-08-01), Budman
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5276999 (1994-01-01), Bando
patent: 5297361 (1994-03-01), Baldy et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5558568 (1996-09-01), Talieh et al.
patent: 5575707 (1996-11-01), Talieh et al.

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