Technique for forming a passivation layer prior to...

Details Technique for forming a passivation layer prior to... Technique for forming a passivation layer prior to...

2007-08-21

2007-08-21

Everhart, Caridad M. (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S751000, C257SE21570, C257SE21520

Reexamination Certificate

active

11112509

ABSTRACT:
By performing a wet chemical process after etching a via, contaminations may be removed and a thin passivation layer may be formed that may then be readily removed in a subsequent sputter etch process for forming a barrier/adhesion layer. In a particular embodiment, the wet chemical process may be performed on the basis of fluoric acid and triazole or a compound thereof.

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