Technique for detecting particles on a wafer support surface

Details Technique for detecting particles on a wafer support surface Technique for detecting particles on a wafer support surface

1996-12-11

1997-12-16

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

216 60, 216 85, H01L 2100

Patent

active

056980698

ABSTRACT:
A method of detecting particles on a wafer support surface comprising positioning a wafer in a first position on the surface with the wafer in the first position, generating a first pattern on the wafer, and moving the wafer. Then, after moving the wafer, generating a second pattern on the wafer to generate a moire pattern by the interaction of the second pattern with the first pattern. The moire pattern is inspected to identify any visual distortion in the moire pattern due to physical distortion of the wafer caused by a particle on the support surface during the generation of the first pattern. The patterns may be ruled parallel lines, and the second pattern may be moved during inspection to shift the moire pattern to reveal distortions over a wide area.

REFERENCES:
patent: 4167337 (1979-09-01), Jaerisch et al.

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