Technique for boron implantation

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S424000, C250S425000, C250S426000, C250S42300F, C438S510000, C438S513000, C438S514000, C438S515000, C438S516000, C423S289000, C423S294000, C423S276000

Reexamination Certificate

active

07397048

ABSTRACT:
A technique for boron implantation is disclosed. In one particular exemplary embodiment, the technique may be realized by an apparatus for boron implantation. The apparatus may comprise a reaction chamber. The apparatus may also comprise a source of pentaborane coupled to the reaction chamber, wherein the source is capable of supplying a substantially pure form of pentaborane into the reaction chamber. The apparatus may further comprise a power supply that is configured to energize the pentaborane in the reaction chamber sufficiently to produce a plasma discharge having boron-bearing ions.

REFERENCES:
patent: 4483911 (1984-11-01), Ogawa et al.
patent: 4957773 (1990-09-01), Spencer et al.
patent: 5277932 (1994-01-01), Spencer
patent: 5468978 (1995-11-01), Dowben
patent: 5658834 (1997-08-01), Dowben
patent: 5977552 (1999-11-01), Foad
patent: 5993766 (1999-11-01), Tom et al.
patent: 6025611 (2000-02-01), Dowben
patent: 6440786 (2002-08-01), Dowben
patent: 6479828 (2002-11-01), Perel
patent: 6600177 (2003-07-01), Dowben
patent: 6905947 (2005-06-01), Goldberg
patent: 2002/0045300 (2002-04-01), Dowben
patent: 2002/0076918 (2002-06-01), Han et al.
patent: 2004/0119025 (2004-06-01), Klepper et al.
patent: 2005/0163693 (2005-07-01), Spielvogel et al.
patent: 2006/0097193 (2006-05-01), Horsky et al.
M.A. Foad, R. Webb, R. Smith, J. Matsuo, A. Al-Bayati, T. Shen-Wang, T. Cullis, Shallow junction formation by decaborane molecular ion implantation, J. Vac. Sci. Technol. B 18 (2000) 445-449.
K. Goto, J. Matsuo, T. Sugii, H. Minakata, I. Yamada, and T. Hisatsugu: Novel Shallow Junction Technology Using Decaborane (B10 H14). IEDM Tech. Dig., p. 435, 1996.

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