Technique for attaching die to leads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

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C257S700000

Reexamination Certificate

active

10985094

ABSTRACT:
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminates over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.

REFERENCES:
patent: 4652973 (1987-03-01), Baker et al.
patent: 4778950 (1988-10-01), Lee et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5076485 (1991-12-01), MacKay
patent: 5140405 (1992-08-01), King et al.
patent: 5162613 (1992-11-01), Schoenthaler
patent: 5173369 (1992-12-01), Kataoka
patent: 5252853 (1993-10-01), Michii
patent: 5408190 (1995-04-01), Wood et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5612259 (1997-03-01), Okutomo et al.
patent: 5624268 (1997-04-01), Maeda et al.
patent: 5749997 (1998-05-01), Tang et al.
patent: 5807767 (1998-09-01), Stroupe
patent: 5945729 (1999-08-01), Stroupe
patent: 6069028 (2000-05-01), Stroupe
patent: 6307254 (2001-10-01), Stroupe
patent: 6309913 (2001-10-01), Stroupe
patent: 6472725 (2002-10-01), Stroupe
patent: 6555897 (2003-04-01), Stroupe
Lambert, W.R., et al., “Use of Anisotropically Conductive Elastomers in High Density Separable Connectors,” Electronic Components Conference, 1989 Proceedings 39th, pp. 99-106 (May 24, 1989).

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