Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-12-11
2007-12-11
Rose, Kiesna (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S700000
Reexamination Certificate
active
10985094
ABSTRACT:
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminates over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
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Lambert, W.R., et al., “Use of Anisotropically Conductive Elastomers in High Density Separable Connectors,” Electronic Components Conference, 1989 Proceedings 39th, pp. 99-106 (May 24, 1989).
Micro)n Technology, Inc.
Rose Kiesna
TraskBritt PC
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