Target mounting apparatus for vapor deposition system

Details Target mounting apparatus for vapor deposition system Target mounting apparatus for vapor deposition system

1997-07-11

1999-01-26

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1434

Patent

active

058633979

ABSTRACT:
Target mounting apparatus for use in a conventional physical vapor deposition system includes a target assembly, a source mounting plate, means for removably mounting the target assembly on the source mounting plate, and a keying system for preventing mounting of a target assembly which is incompatible with the deposition process intended to be carried out. The keying system includes a male portion formed on either the target assembly or the source mounting plate, and a female portion formed on the other of the target assembly and the source mounting plate. Keying of the target assembly to the source mounting plate is achieved by either forming the male and female portions with unique, mating cross sectional shapes, or by varying the spatial orientation or alignment of the male and female portions. In an alternate embodiment, a key pin is positionable in any of a plurality of positions on the source mounting plate, respectively corresponding to differing target assemblies. A target assembly can only be mounted on the source mounting plate when the key pin is in a corresponding correct position, thus acting as a positive reminder to the equipment operator to install the correct target assembly for the process to be carried out.

REFERENCES:
patent: 4885075 (1989-12-01), Hillman
patent: 5641389 (1997-06-01), Strauss et al.

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