Target for sputtering and a method for manufacturing a...

Details Target for sputtering and a method for manufacturing a... Target for sputtering and a method for manufacturing a...

2008-07-15

2008-07-15

McDonald, Rodney G (Department: 1795)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298120, C204S298180

Reexamination Certificate

active

07399387

ABSTRACT:
A target for sputtering includes a sputtering material layer having tilt surfaces. Sputtering material particles are emitted from the tilt surfaces in directions of their normals. Consequently, even though the target and a substrate are arranged approximately parallel and the axes of the two are coincident with each other, the particles are injected onto the substrate from oblique directions.

REFERENCES:
patent: 6143149 (2000-11-01), Abe
patent: 01-227224 (1989-09-01), None
patent: 07-057237 (1995-03-01), None
patent: 2001-014664 (2001-01-01), None
Machine Translation of 07-057237 dated Mar. 1995.

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