Target body position measuring method for charged particle beam

Details Target body position measuring method for charged particle beam Target body position measuring method for charged particle beam

1983-08-29

1985-12-10

Anderson, Bruce C.

Radiant energy

Means to align or position an object relative to a source or...

2504421, G01B 1500, G03F 900

Patent

active

045582254

ABSTRACT:
Disclosed is a method for measuring the position of a silicon wafer as a workpiece to be exposed. The method is suitably used in an electron beam exposure system. A wafer has a plurality of chip alignment marks which respectively designate a plurality of chip field areas, included in a dicing line area. When the wafer is contained ion a holder and is fixed in the exposure system, edge portions of the wafer are partially scanned with the electron beam to roughly measure the position of the wafer. In accordance with this wafer position data, a wafer surface portion required for detecting only the marks is defined within the dicing line area. In the mark detection with the electron beam, the electron beam irradiates only the defined wafer surface portion of the wafer surface, thereby providing highly precise measurement of the wafer position and avoiding undesirable irritation of the circuit formation area.

REFERENCES:
patent: 3513285 (1970-05-01), Imura
patent: 4322626 (1982-03-01), Kawashima
patent: 4365163 (1982-12-01), Davis et al.
patent: 4413186 (1983-11-01), Uema
patent: 4433243 (1984-02-01), Nakamura et al.
JEE Journal of Electronic Engineering, vol. 18, No. 177, Sep. 1981, Tokyo, Y. Fukatsu et al., pp. 92-95, "Auto Alignment Method," and FIG. 5.
Proceeding of SPIE, vol. 334, Mar. 31-Apr. 1, 1982, p. 139, Herbert E. Mayer, Ernst W. Loebach.

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