Target arrangement with a circular plate, magnetron for mounting

Details Target arrangement with a circular plate, magnetron for mounting Target arrangement with a circular plate, magnetron for mounting

1996-08-23

2000-05-30

McDonald, Rodney

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429811, 20429812, 20429819, C23C 1434

Patent

active

060687428

ABSTRACT:
A target arrangement for a sputtering apparatus has a circular plate target with either a circumferential protrusion or recess which is symmetrical about a central plane through the target, the plane being perpendicular to the central axis of the target and located halfway between the top and bottom surfaces of the target. Each surface of the target is composed primarily of sputtering material. A magnetron for use with the target arrangement for easy changing of the target to sputter using the opposite surface of the target is disclosed. A process for using the target arrangement and magnetron assembly to sputter a work piece is also disclosed.

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Patent Abstracts of Japan, vol. 95, No. 2, Mar. 31, 1995--JP 06 306597A.

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