Tapering of holes through dielectric layers for forming contacts

Details Tapering of holes through dielectric layers for forming contacts Tapering of holes through dielectric layers for forming contacts

1989-11-14

1993-07-13

Jones, W. Gary

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156657, H01L 21283

Patent

active

052270149

ABSTRACT:
Step coverage in contacts may be improved by forming a tapered hole through a dielectric layer by:

REFERENCES:
patent: 4656732 (1987-04-01), Teng et al.
patent: 4657628 (1987-04-01), Holloway et al.
patent: 4660278 (1987-04-01), Teng
patent: 4707218 (1987-11-01), Giammarco et al.

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