Tapered three-wire line vertical connections

Details Tapered three-wire line vertical connections Tapered three-wire line vertical connections

1996-03-25

1997-11-25

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Transmission line lead

257665, 257775, H01L 2940, H01L 2358

Patent

active

056915667

ABSTRACT:
An electrical connection is provided between a 3-wire transmission line buried in a dielectric substrate and corresponding first, second and third conductive pads formed on a substrate surface. The 3-wire line includes first, second and third wires having a wire cross-sectional dimension. A tapered section connects each wire of the 3-wire line to a corresponding pad. Each tapered section increases in cross-sectional dimension from a first end connected to an end of the wire and a second end connected to a pad. The tapered sections provide a smooth transition of electromagnetic fields between the 3-wire line and the pads.

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patent: 5027174 (1991-06-01), Mimoto
patent: 5043792 (1991-08-01), Adachi
patent: 5539247 (1996-07-01), Cheung et al.
Cavaliere et al, IBM Tech Dis. Bull. vol. 21 No. 12 May 1979 p. 4827.
"Ceramic multichip modules," B. Hargis, Inside ISHM, Mar./Apr. 1993, pp. 15-18.
"Low loss, low temperature cofired ceramic for microwave multichip modules," A. Piloto et al., Proc. 1994 ISHM Symposium, pp. 318-323.

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