Tapered edge bead removal process for immersion lithography

Details Tapered edge bead removal process for immersion lithography Tapered edge bead removal process for immersion lithography

2007-09-19

2010-11-02

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Processing feature prior to imaging

Reexamination Certificate

active

07824846

ABSTRACT:
A method and apparatus for forming a tapered photoresist edge. The method includes: forming a photoresist layer on a substrate; exposing a first annular region of the photoresist layer adjacent to a perimeter of the substrate to actinic radiation, the first annular region having a first outer perimeter proximate to a perimeter of the substrate and a first inner perimeter away from the perimeter of the substrate, the actinic radiation gradually decreasing in intensity from the first outer perimeter to the first inner perimeter; and developing the exposed first annular region of the photoresist layer to form a tapered profile in a second annular region of the photoresist layer, the second annular region having a second perimeter proximate to the perimeter of the substrate and a second inner perimeter away from the substrate perimeter, the profile gradually increasing in thickness from the second outer perimeter to the second inner perimeter.

REFERENCES:
patent: 2005/0255702 (2005-11-01), Honeycutt et al.
patent: 2007/0003879 (2007-01-01), Chang et al.

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