Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-07-11
2006-07-11
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S670000
Reexamination Certificate
active
07074654
ABSTRACT:
A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape covers at least portions of the top contact surfaces of the contacts, at least portions of the top tie bar surfaces of the tie bars, and at least a portion of the top dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is then electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the semiconductor die and the tape are covered by the body and the bottom contact surfaces are exposed in an exterior surface thereof.
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d'Estries Maximilien
Miks Jeffrey A.
Shermer Stephen G.
Zwenger Curtis M.
Amkor Technology Inc.
Jr. Carl Whitehead
Rodgers Colleen E.
Stetina Brunda Garred & Brucker
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