Tape substrate, tape package and flat panel display using same

Details Tape substrate, tape package and flat panel display using same Tape substrate, tape package and flat panel display using same

2006-01-23

2008-10-14

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S749000, C361S784000, C174S254000, C174S255000, C174S260000, C174S262000, C174S1170FF

Reexamination Certificate

active

07435914

ABSTRACT:
A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape package may be bent and located behind at least one side of the panel.

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patent: 6555755 (2003-04-01), Yanagisawa
patent: 2005/0078459 (2005-04-01), Yeon
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patent: 1020030045224 (2003-06-01), None
patent: 1020050011205 (2005-01-01), None

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