Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2005-01-26
2009-08-11
Norton, Nadine G (Department: 1792)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S612000, C438S455000, C438S758000
Reexamination Certificate
active
07572739
ABSTRACT:
A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer comprises an adhesive material. The method includes the step of submerging the tape in a liquid chemical comprising monoethanolamine or an alkanolamine for a pre-specified period of time sufficient to allow for a separation of the tape from the semiconductor substrate without damaging devices on the semiconductor substrate.
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Codding Steven R.
Krywanczyk Timothy C
Perrotte Steven G.
Ritter Jason P.
Dahimene Mahmoud
International Business Machines - Corporation
Norton Nadine G
Sabo William D.
Schmeiser Olsen & Watts
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