Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent
1997-11-06
2000-11-14
Crispino, Richard
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
156531, 83622, 400621, B32B 3100, B26D 508, B41J 1500
Patent
active
06145561&
ABSTRACT:
A tape processing device has a feed device, a cutter assembly, and a coating device. The feed device feeds a tape having a layer of an adhesive. The cutter assembly has at least one cutting blade and cuts the tape. The coating device applies an adhesion-preventing liquid on the at least one cutting blade of the cutter assembly to thereby prevent any of the tape and the adhesive of the tape from adhering to the at least one cutting blade of the cutter assembly.
REFERENCES:
patent: 2284859 (1942-06-01), Blair
patent: 2496018 (1950-01-01), Pearson
patent: 2524653 (1950-10-01), Dalley
patent: 2568234 (1951-09-01), Haufrect
patent: 2597519 (1952-05-01), O'Brien
patent: 2708311 (1955-05-01), McCloud
patent: 2873526 (1959-02-01), Visconti
patent: 3387642 (1968-06-01), Bennett
patent: 3735763 (1973-05-01), Shannon
patent: 3827125 (1974-08-01), Matthews
patent: 4048721 (1977-09-01), Gunson
patent: 4089113 (1978-05-01), Moritz et al.
patent: 4288280 (1981-09-01), Morin
patent: 4398441 (1983-08-01), Jue
patent: 4417941 (1983-11-01), Lin
patent: 4481053 (1984-11-01), Tokuno et al.
patent: 4544293 (1985-10-01), Cranston et al.
patent: 4742742 (1988-05-01), Yokoe
patent: 4768259 (1988-09-01), Rock et al.
patent: 4964216 (1990-10-01), Gosselin
patent: 4967474 (1990-11-01), Wells
patent: 4978415 (1990-12-01), Jones
patent: 5259681 (1993-11-01), Kitazawa et al.
patent: 5319854 (1994-06-01), Pracht
patent: 5441352 (1995-08-01), Shiota
patent: 5447383 (1995-09-01), Hirono et al.
patent: 5458423 (1995-10-01), Sims et al.
patent: 5492420 (1996-02-01), Nunokawa et al.
patent: 5595447 (1997-01-01), Takayama et al.
patent: 5597247 (1997-01-01), Inakoshi et al.
patent: 5611253 (1997-03-01), Saito et al.
patent: 5986874 (1991-01-01), Kawada
Translation to Japanes Patent No. 6-79934, Mar. 22, 1994.
Eto Youko
Iida Hironaga
Kameda Takanobu
Moriya Tomohiro
Shimmura Tomoyuki
Crispino Richard
Purvis Sue A.
Seiko Epson Corporation and King Jim Co., Ltd.
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