Tape processing device with a coating device for the cutting bla

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing

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Details

156531, 83622, 400621, B32B 3100, B26D 508, B41J 1500

Patent

active

06145561&

ABSTRACT:
A tape processing device has a feed device, a cutter assembly, and a coating device. The feed device feeds a tape having a layer of an adhesive. The cutter assembly has at least one cutting blade and cuts the tape. The coating device applies an adhesion-preventing liquid on the at least one cutting blade of the cutter assembly to thereby prevent any of the tape and the adhesive of the tape from adhering to the at least one cutting blade of the cutter assembly.

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Translation to Japanes Patent No. 6-79934, Mar. 22, 1994.

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