Tape circuit substrate with reduced size of base film

Details Tape circuit substrate with reduced size of base film Tape circuit substrate with reduced size of base film

2011-05-24

2011-05-24

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S749000, C361S782000, C174S254000, C174S255000

Reexamination Certificate

active

07948768

ABSTRACT:
A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate.

REFERENCES:
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Japanese Patent Publication No. 2003-255386 to Otomo, having Publication date of Sep. 10, 2003 (w/ English Abstract page).

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