Tape carrier structure for a tape carrier package

Details Tape carrier structure for a tape carrier package Tape carrier structure for a tape carrier package

1995-11-24

1998-11-24

Graybill, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257676, 257692, 257735, 257741, 257773, H01L 2156, H01L 2158, H01L 2160

Patent

active

058411887

ABSTRACT:
A tape carrier structure (T1,T2) for a tape carrier package on which at least one semiconductor chip (1) is mounted, the tape carrier structure (T1,T2) having a polyimide tape (3) and leads (2) joined onto the polyimide tape (3), an end of each of the leads (2) being connected to one of connecting pads corresponding thereto, the connecting pads being provided on the semiconductor chip (1), wherein the polyimide tape (3) has a facing portion (3a) which is situated so as to face to the semiconductor chip (1) except the connecting pads on condition that the semiconductor chip (1) is mounted on the tape carrier package.

REFERENCES:
patent: 4967261 (1990-10-01), Niki et al.
patent: 5075252 (1991-12-01), Schendelman
patent: 5409866 (1995-04-01), Sato et al.
patent: 5446313 (1995-08-01), Masuda et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5589420 (1996-12-01), Russell

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