Tape carrier semiconductor device

Details Tape carrier semiconductor device Tape carrier semiconductor device

1991-11-22

1994-01-25

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257735, 257787, H01L 2328

Patent

active

052818489

ABSTRACT:
A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

REFERENCES:
patent: 4143456 (1979-03-01), Inoue
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4819041 (1989-04-01), Redmond
patent: 4910582 (1990-03-01), Miyamoto et al.
patent: 4926239 (1990-05-01), Fujita et al.
Patent Abstracts of Japan, vol. 10, No. 244, 22 Aug. 1986, and JP-A-61 075 549, 17 Apr. 1986.
Patent Abstracts of Japan, vol. 10, No. 302, 15 Oct. 1986, and JP-A-61 115 342, 2 Jun. 1986.

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