Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1994-03-15
1996-04-09
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257668, 257735, 257787, H01L 23495, H01L 2328
Patent
active
055064442
ABSTRACT:
In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.
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patent: 4910582 (1990-03-01), Miyamoto et al.
patent: 4926239 (1990-05-01), Fujita et al.
patent: 5220196 (1993-06-01), Michii et al.
patent: 5281848 (1994-01-01), Chikawa et al.
patent: 5334858 (1994-08-01), Wada
Patent Abstracts of Japan, vol. 10, No. 244, 22 Aug. 1986, and JP-A-61 075 549, 17 Apr. 1986.
Patent Abstracts of Japan, vol. 10, No. 302, 15 Oct. 1986, and JP-A-61 115 342, 2 Jun. 1986.
Patent Abstracts of Japan, vol. 10, No. 244 (E-430)(2300) 22 Aug. 1986 & JP-A-61 075 549 (Toshiba Corp.) Apr. 11, 1986.
Patent Abstracts of Japan, vol. 10, No. 302 (E-445)(2358) 15 Oct. 1986 & JP-A-61 115 342 (Nitto Electric Ind Co) 2 Jun. 1986.
Chikawa Yasunori
Honda Yoshiaki
Maeda Takamichi
Mori Katsunobu
Osono Mitsuaki
Clark S. V.
Crane Sara W.
Sharp Kabushiki Kaisha
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