Tape carrier package semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Patent

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Details

257666, 257674, 257723, 257724, 257773, H01L 23495, H01L 2334, H01L 2348

Patent

active

056147600

ABSTRACT:
In a TCP (tape carrier package) semiconductor device having opposing, inner lead arrays bonded to a semiconductor device, a projection or projections are provided on each of the inner leads disposed at intervals of a greater distance on one side of the semiconductor, within a range for allowing the resin to flow out.

REFERENCES:
patent: 4996583 (1991-02-01), Hatada
patent: 5157478 (1992-10-01), Ueda et al.
patent: 5250842 (1993-10-01), Ikeda

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