Tape carrier package including a heat dissipation element

Details Tape carrier package including a heat dissipation element Tape carrier package including a heat dissipation element

2006-12-05

2010-10-26

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S694000, C257S707000, C257S735000, C257SE23010, C257SE23014, C257SE23031, C257SE23034, C257SE23043, C257SE23141, C361S773000, C361S813000, C438S123000

Reexamination Certificate

active

07821115

ABSTRACT:
A semiconductor device on a tape carrier package with improved heat dissipation, as provided. The number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration, and narrower pitches are employed. Included are a tape carrier20having lead patterns21to24formed on a tape base28thereof, and a semiconductor device10mounted on the tape carrier20and having electrode patterns11to14disposed thereon. The semiconductor device10includes heat dissipating electrode patterns15to17at positions where the heat dissipating electrode patterns15to17do not interfere with the electrode patterns11to14. The lead patterns21to24are electrically connected to the corresponding electrode patterns11to14, respectively. On the tape carrier20, heat dissipation patterns25to27are formed. The heat dissipation patterns have a surface area broader than that of the lead patterns and have the heat dissipating electrode patterns disposed thereon.

REFERENCES:
patent: 6713850 (2004-03-01), Yuan et al.
patent: 2-155248 (1990-06-01), None
patent: 3-57248 (1991-03-01), None
patent: 10-32229 (1998-02-01), None
patent: 2004-111996 (2004-04-01), None

Affiliated with

Also associated with

Rating

Tape carrier package including a heat dissipation element does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape carrier package including a heat dissipation element, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape carrier package including a heat dissipation element will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4183712