Tape carrier package having stacked semiconductor elements,...

Details Tape carrier package having stacked semiconductor elements,... Tape carrier package having stacked semiconductor elements,...

2006-05-23

2006-05-23

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S686000, C257S666000, C257S786000, C257S784000, C257S685000, C257S723000, C257S777000, C257S796000, C257S684000, C257S698000, C257S696000, C257S676000, C257S773000, C257S774000, C257S783000, C174S254000, C174S261000, C174S255000, C029S846000

Reexamination Certificate

active

07049687

ABSTRACT:
A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

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