Tape carrier for semiconductor apparatus

Details Tape carrier for semiconductor apparatus Tape carrier for semiconductor apparatus

1992-02-13

1994-11-22

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

257666, B32B 900

Patent

active

053667948

ABSTRACT:
A tape carrier for semiconductor apparatus and a method of manufacturing the tape carrier includes three or more layers and contact holes of small size. A peelable agent is applied to a planar substrate made of glass or the like, and plural insulating layers and plural conductive layers are alternatingly formed thereon in predetermined patterns. The peelable agent is then removed to peel the tape carrier from the substrate. The tape carrier includes the insulating layers and the conductive layers and has projection electrodes but no tape base.

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patent: 4903114 (1990-02-01), Aoki et al.
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patent: 4961984 (1990-10-01), Takeda
patent: 4982268 (1991-01-01), Schuermann
patent: 5118556 (1992-06-01), Makino et al.
patent: 5196917 (1993-03-01), Ueda et al.
"Patent Abstracts of Japan", E-756, May 11, 1989, vol. 13, No. 198.
"Patent Abstracts of Japan", E-1075, Jun. 7, 1991, vol. 15, No. 223.
"Technique to Fabricate Co-Planar Conductors in a Dielectric Layer", IBM Technical Disclosure Bulletin, vol. 33, Jul. 1990, pp. 258-259.
"Mit Sacklochern und, vergrabenen 'Bohrungen den Multilayer optimieren," Productronic 5-1991, S. 102.
"Advanced TAB Circuits", a catalogue for TAB tape by Rogers Co., Ltd, 1990.
"Two Layer TAB Tape", 3M.

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