Tape carrier device having an adhesive resin overcoat and a poly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257790, 257792, H01L 23495, H01L 2329

Patent

active

058148795

ABSTRACT:
A tape carrier comprises an insulating film and a pattern formed of a metal foil on at least one side surface of said film, said tape carrier being characterized in that an adhesive resin overcoat is applied to the pattern surface portion around a portion to be coated with an IC sealing resin, and a polyimide resin-based overcoat is applied to the remaining pattern surface portion.

REFERENCES:
patent: 5176366 (1993-01-01), Masumoto et al.
patent: 5357400 (1994-10-01), Takekawa
patent: 5359222 (1994-10-01), Okutomo et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Tape carrier device having an adhesive resin overcoat and a poly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape carrier device having an adhesive resin overcoat and a poly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape carrier device having an adhesive resin overcoat and a poly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-688216

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.