Tape automated manufacture of power semiconductor devices

Details Tape automated manufacture of power semiconductor devices Tape automated manufacture of power semiconductor devices

1984-06-04

1987-01-06

Edlow, Martin H.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 81, 174 52PE, 428571, 29839, H01L 2348, H01L 2302, H02G 1308, B22F 326

Patent

active

046350926

ABSTRACT:
Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a main current lead. The manufacturing process permits thorough electrical testing of a power semiconductor chip prior to incorporation into a relatively expensive power device package. In particular, the power chip can be tested at full-rated current, at least where the current is pulsed at a low duty cycle.

REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 3763404 (1973-10-01), Aird
patent: 4234666 (1980-11-01), Gursky
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4459607 (1984-07-01), Reid
patent: 4538170 (1985-08-01), Yerman
patent: 4556899 (1985-12-01), Kurihara et al.
patent: 4595945 (1986-06-01), Graver
T. G. O'Neill, "The Status of Tape Automated Bonding", Semi-Conductor International (Feb. 1981), pp. 33-51 (with advertisements omitted).
J. Lyman, "Tape Automated Bonding Meets VLSI Challenge", Electronics (18 Dec. 1980), pp. 100-105.

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