Tape automated bonding method

Details Tape automated bonding method Tape automated bonding method

1995-12-27

1999-12-28

Graybill, David E.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, 438125, H01L 2156, H01L 2158, H01L 21603

Patent

active

060080728

ABSTRACT:
This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention provides a method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed.

REFERENCES:
patent: 4731282 (1988-03-01), Tsukagoshi et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5330684 (1994-07-01), Emori et al.
patent: 5393359 (1995-02-01), Chang et al.
patent: 5393697 (1995-02-01), Chang et al.
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5582242 (1996-12-01), Hamburgen et al.
patent: 5729315 (1998-03-01), Takahashi et al.
patent: 5749997 (1998-05-01), Tang et al.

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