Tailoring of via-hole sidewall slope

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156644, 156655, 156657, 1566591, 156668, 20419232, 430317, H01L 21312, B44C 122, C03C 2506

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active

046247408

ABSTRACT:
A method of selectively tailoring the slope of via hole sidewalls. A first polyimide layer (in which the vias are to be formed) is covered by a strippable layer, and the two layers are isotropically etched. By varying the thickness of the strippable layer with respect to that of the polyimide layer, the slope of the via hole sidewalls can be controlled.

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