Tablet comprising epoxy resin composition

Details Tablet comprising epoxy resin composition Tablet comprising epoxy resin composition

2005-08-23

2005-08-23

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S702000, C525S466000, C525S481000, C525S423000

Reexamination Certificate

active

06933618

ABSTRACT:
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.

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