Table of wafer polishing apparatus, method for polishing...

Details Table of wafer polishing apparatus, method for polishing... Table of wafer polishing apparatus, method for polishing...

2006-05-09

2006-05-09

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S028000

Reexamination Certificate

active

07040963

ABSTRACT:
A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table (2) includes a plurality of superimposed bases (11) each of which is formed of silicide ceramic or carbide ceramic. The bases (11) are joined together by an adhesive layer (14). A fluid passage (12) is formed in a joining interface between the bases (11).

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