Tab package and a liquid-crystal panel unit using the same

Details Tab package and a liquid-crystal panel unit using the same Tab package and a liquid-crystal panel unit using the same

1991-03-06

1992-10-06

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 72, 361408, H01L 2348

Patent

active

051537052

ABSTRACT:
A TAB package for packaging a semiconductor chip includes a flexible base plate having a first surface and a second surface opposite to the first surface, an input and output leads being formed on the second surface of the flexible base plate and capable of being connected to the semiconductor chip, and a plurality of slits being formed on the first surface of the flexible base plate. Accordingly, the TAB package is allowed to be easily bent and kept in the bending state. The slits are formed in a manner to correspond to the intervals between the adjacent input and output leads so that the input and output leads can be reliably supported by the flexible base plate.

REFERENCES:
patent: 4684974 (1987-08-01), Matsunaga et al.
patent: 4887149 (1989-12-01), Ramano' 357 74
"TAB Tape Structure for Area Array TAB," IBM Technical Disclosure Bulletin, vol. 32, No. 2, Jul. 1989, pp. 305-306.
"Stress Relief Method for TAB Modules," IBM Technical Disclosure Bulletin, vol. 33, No. 10B, Mar. 1991, pp. 158-159.

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