Systems with high density packing of micromachines

Details Systems with high density packing of micromachines Systems with high density packing of micromachines

2005-10-11

2005-10-11

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S455000, C438S459000, C257S415000, C257S417000, C257S422000, C257S467000

Reexamination Certificate

active

06953704

ABSTRACT:
Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.

REFERENCES:
patent: 5999306 (1999-12-01), Atobe et al.
patent: 2002/0172445 (2002-11-01), Michalicek
Kurth S. et al.: “Silicon Mirrors and Micromirror Arrays for Spatial Laser Beam Modulation,” Sensors and Actuators, A, Elsevier Sequoia S.A., Lausanne, CH, vol. 66, No. 1-3.
Kurth S. et al. “Syncronously Working Micromirrors for Beam Steering: Design and Application Aspects,” Proceedings of the SPIE, Optical Scanning Design and Application, Jul. 1999.
Hiller K. et al: “Low Temperature Approaches for Fabrication of High-Frequency Microscanners.” Proceedings of the SPIE, Minitaturized Systems with Micro-Optics and Mems, Sep. 1999.
Johansen L., et al.: “Electroforming of 3D Microstructures on Highly Structured Surfaces,” A. Elsevier Sequoia S.A., Lausanne, CH, vol. 83, No. 1-3, May 2000.
Adrain Michalicek, Hidden Flexure Ultra Planar Optical Routing Element, US Pub. 20020172445, Pub. date Nov. 21, 2002.

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