Systems and pads for planarizing microelectronic workpieces...

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S008000, C451S041000, C451S287000

Reexamination Certificate

active

07967661

ABSTRACT:
Planarizing systems and methods of planarizing microelectronic workpieces using mechanical and/or chemical-mechanical planarization are disclosed herein. In one embodiment, a planarizing system includes a platen having a support surface carrying a planarizing pad. The planarizing pad includes an optically transmissive window extending through the planarizing pad that forms a continuous segment of the planarizing pad. The system also includes a workpiece carrier configured to move the workpiece relative to the planarizing pad and an optical monitor positioned proximate to the platen. The optical monitor emits light through the window and detects reflected light from the workpiece through the window.

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