Systems and methods to laminate passives onto substrate

Details Systems and methods to laminate passives onto substrate Systems and methods to laminate passives onto substrate

2006-12-20

2010-11-23

Nguyen, Thinh T (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S557000, C029S841000

Reexamination Certificate

active

07838419

ABSTRACT:
A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.

REFERENCES:
patent: 4466181 (1984-08-01), Takishima
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5225023 (1993-07-01), Wojnarowski et al.
patent: 5291066 (1994-03-01), Neugebauer et al.
patent: 6838750 (2005-01-01), Nuytkens et al.

Affiliated with

Also associated with

Rating

Systems and methods to laminate passives onto substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods to laminate passives onto substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods to laminate passives onto substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4201537