Systems and methods for removing wafer edge residue and...

Details Systems and methods for removing wafer edge residue and... Systems and methods for removing wafer edge residue and...

2011-08-16

2011-08-16

Karls, Shay (Department: 3723)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C015S077000, C451S043000

Reexamination Certificate

active

07998865

ABSTRACT:
A system (500) removes wafer edge residue from a target wafer (508). A wafer holding mechanism (502) holds and rotates the target wafer (508). A residue remover mechanism (504) mechanically interacts or abrades an edge surface of the target wafer (508) and removes strongly adhered residue from the edge surface of the target wafer (508). The residue remover mechanism (504) controls coverage of the mechanical interaction and magnitude of the mechanical interaction.

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