Systems and methods for reducing electrostatic charge of...

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Reexamination Certificate

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C451S041000, C451S287000, C438S692000

Reexamination Certificate

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07922562

ABSTRACT:
A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading. At least one of the wafer carrier and the transfer station is configured to dissipate electrostatic charge from the wafer.

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