Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2011-04-12
2011-04-12
Rachuba, Maurina (Department: 3727)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S041000, C451S287000, C438S692000
Reexamination Certificate
active
07922562
ABSTRACT:
A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading. At least one of the wafer carrier and the transfer station is configured to dissipate electrostatic charge from the wafer.
REFERENCES:
patent: 3672930 (1972-06-01), Trachtenberg
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5612144 (1997-03-01), Shinohara et al.
patent: 6354479 (2002-03-01), Reiber et al.
patent: 6537143 (2003-03-01), Yang et al.
patent: 2002/0135966 (2002-09-01), Tanaka et al.
patent: 2002/0177518 (2002-11-01), Kwon et al.
patent: 2003/0045219 (2003-03-01), Yang et al.
patent: 2004/0127142 (2004-07-01), Olgado
patent: 2004/0183135 (2004-09-01), Kwon et al.
patent: 2004/0187451 (2004-09-01), Suzuki et al.
patent: 2005/0176349 (2005-08-01), Yilmaz et al.
patent: 2005/0209391 (2005-09-01), Nakayama et al.
patent: 2005/0254190 (2005-11-01), Kwon et al.
patent: 2006/0185784 (2006-08-01), Fuentes et al.
patent: 2008/0227374 (2008-09-01), Schmidt et al.
Durning Jeffrey M.
Ritter, III Curtis J.
Stump Sherman D.
Ward A. Trent
Micro)n Technology, Inc.
Perkins Coie LLP
Rachuba Maurina
LandOfFree
Systems and methods for reducing electrostatic charge of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems and methods for reducing electrostatic charge of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for reducing electrostatic charge of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2698117