Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-04-12
2009-06-23
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C700S121000
Reexamination Certificate
active
07550303
ABSTRACT:
Method for measuring misalignment between at least two layers of an integrated circuit. The method includes applying a current between a plurality of probe members in a first layer, wherein a first probe member and a second probe member of the plurality of probe members are substantially aligned along a first axis and partially overlap an overlay target in a second layer, measuring a voltage across the plurality of probe members wherein at least a voltage across the first probe member and a third probe member disposed perpendicular to the first axis and a voltage across the second probe member and the third probe member are measured, and determining an amount of misalignment between the first layer and the second layer along at least one of the first axis and the second axis based on the measuring steps.
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Argandona Patricia
Azam Faisal
Lu Andrew
Wang Helen
Abate Joseph P.
Greenblum & Bernstein P.L.C.
International Business Machines - Corporation
Pert Evan
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