Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Mechanical measurement system
Reexamination Certificate
2011-03-22
2011-03-22
Bui, Bryan (Department: 2857)
Data processing: measuring, calibrating, or testing
Measurement system in a specific environment
Mechanical measurement system
C356S237500
Reexamination Certificate
active
07912658
ABSTRACT:
Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.
REFERENCES:
patent: 4162126 (1979-07-01), Nakagawa et al.
patent: 4410278 (1983-10-01), Makihira et al.
patent: 4845558 (1989-07-01), Tsai et al.
patent: 4898471 (1990-02-01), Vaught et al.
patent: 5355212 (1994-10-01), Wells et al.
patent: 5555315 (1996-09-01), Itakura
patent: 5608453 (1997-03-01), Gerber et al.
patent: 5625451 (1997-04-01), Schiff et al.
patent: 5661408 (1997-08-01), Kamieniecki et al.
patent: 5712701 (1998-01-01), Clementi et al.
patent: 5903342 (1999-05-01), Yatsugake et al.
patent: 5909276 (1999-06-01), Kinney et al.
patent: 5991699 (1999-11-01), Kulkarni et al.
patent: 6118525 (2000-09-01), Fossey et al.
patent: 6171975 (2001-01-01), Hase et al.
patent: 6201601 (2001-03-01), Vaez-Iravani et al.
patent: 6265719 (2001-07-01), Yamazaki et al.
patent: 6271916 (2001-08-01), Marxer et al.
patent: 6538730 (2003-03-01), Vaez-Iravani et al.
patent: 6552337 (2003-04-01), Cho et al.
patent: 6558853 (2003-05-01), Kawamura
patent: 6563577 (2003-05-01), Oomori et al.
patent: 6596553 (2003-07-01), Lin et al.
patent: 6603877 (2003-08-01), Bishop et al.
patent: 6636031 (2003-10-01), Kenmochi et al.
patent: 6718526 (2004-04-01), Eldredge et al.
patent: 6781688 (2004-08-01), Kren et al.
patent: 6794885 (2004-09-01), Yasumoto
patent: 6858859 (2005-02-01), Kusunose
patent: 6893786 (2005-05-01), Baggenstoss
patent: 6898305 (2005-05-01), Hiroi et al.
patent: 6917419 (2005-07-01), Fielden et al.
patent: 6917433 (2005-07-01), Levy et al.
patent: 6919957 (2005-07-01), Nikoonahad et al.
patent: 7006886 (2006-02-01), Huet et al.
patent: 7038773 (2006-05-01), Kuhlmann et al.
patent: 7067819 (2006-06-01), Janik
patent: 7286218 (2007-10-01), Tiemeyer et al.
patent: 7315642 (2008-01-01), Bartov et al.
patent: 7349079 (2008-03-01), Zhao et al.
patent: 7359052 (2008-04-01), Fielden et al.
patent: 7369233 (2008-05-01), Nikoonahad et al.
patent: 7373277 (2008-05-01), Wu et al.
patent: 7417722 (2008-08-01), Bills et al.
patent: 7528944 (2009-05-01), Chen et al.
patent: 7751046 (2010-07-01), Levy et al.
patent: 2002/0182760 (2002-12-01), Wack et al.
patent: 2003/0011786 (2003-01-01), Levy et al.
patent: 2003/0107736 (2003-06-01), Fujimoto
patent: 2003/0210393 (2003-11-01), Vaez-Iravani et al.
patent: 2003/0228050 (2003-12-01), Geshel et al.
patent: 2004/0066962 (2004-04-01), Sasa et al.
patent: 2004/0095575 (2004-05-01), Woo et al.
patent: 2004/0252879 (2004-12-01), Tiemeyer et al.
patent: 2005/0094864 (2005-05-01), Xu et al.
patent: 2005/0179910 (2005-08-01), Bartov
patent: 2005/0186670 (2005-08-01), Oh
patent: 2005/0252752 (2005-11-01), Fielden et al.
patent: 2006/0062445 (2006-03-01), Verma et al.
patent: 2006/0091332 (2006-05-01), Nishiyama et al.
patent: 2006/0181700 (2006-08-01), Andrews et al.
patent: 2006/0192948 (2006-08-01), Judell et al.
patent: 2006/0192949 (2006-08-01), Bills et al.
patent: 2006/0192950 (2006-08-01), Judell et al.
patent: 2006/0256326 (2006-11-01), Bills et al.
patent: 2006/0290923 (2006-12-01), Nakano et al.
patent: 2007/0024998 (2007-02-01), Bills et al.
patent: 2007/0156379 (2007-07-01), Kulkarni et al.
patent: 2007/0252977 (2007-11-01), Baran et al.
patent: 2007/0288219 (2007-12-01), Zafar et al.
patent: 2008/0004823 (2008-01-01), Matsushita et al.
patent: 2008/0013083 (2008-01-01), Kirk et al.
patent: 2008/0018887 (2008-01-01), Chen et al.
patent: 2008/0129988 (2008-06-01), Saito et al.
patent: 2008/0205745 (2008-08-01), Chen et al.
patent: 2008/0219545 (2008-09-01), Chen et al.
patent: 2009/0037134 (2009-02-01), Kulkarni et al.
patent: 2000-002514 (2000-01-01), None
patent: 2002-257518 (2002-09-01), None
patent: 2008-096430 (2008-04-01), None
patent: 10-1999-0073971 (1999-10-01), None
patent: 10-2001-0001224 (2001-01-01), None
patent: 10-0738809 (2007-07-01), None
patent: WO 2006/066135 (2006-06-01), None
patent: WO 2006/066136 (2006-06-01), None
patent: WO 2006/066137 (2006-06-01), None
patent: WO 2006/066138 (2006-06-01), None
patent: WO 2006/066139 (2006-06-01), None
patent: WO 2006/066205 (2006-06-01), None
patent: WO 2006/066206 (2006-06-01), None
patent: WO 2006/066207 (2006-06-01), None
patent: WO 2006/066255 (2006-06-01), None
Written Opinion and International Report for PCT/US2009/045124, mailed Jan. 7, 2010.
Chen et al. “Laser Scattering Correlation with Polysilicon Surface Roughness and Impact on Electical Performance,” ISSM 2006.
Elson et al. “Relationship of the total integrated scattering from multilayer-coated optics to angle of incidence, polarization, correlation length, and roughness cross-correlation properties,” J.M. et al, Applied Optics, 22, 3207 (1983).
Griffith, J.E. et al.; “Characterization of Scanning Probe Tips for Linewidth Measurement,” J. Vac. Sci. Technol. B 9(6), Nov./Dec. 1991, pp. 3586-3589.
Holsteynes et al. “The use of unpatterned wafer inspection for immersion lithography defectivity studies.” Apr. 2006.
International Search Report and Written Opinion for PCT/US08/71587 mailed on Dec. 17, 2008.
International Search Report and Written Opinion for PCT/US08/75867 mailed on Feb. 17, 2008.
International Application No. PCT/US05/45781 filed on Dec. 12, 2005.
International Search Report and Written Opinion for PCT/US07/69465 mailed on Sep. 17, 2008.
International Search Report for PCT/US07/61912 mailed Feb. 25, 2008.
Larson, C. Thomas; “Measuring Haze on Deposited Metals with Light-Scattering-Based Inspection Systems,” MICRO (Sep. 1996), pp. 31-38.
Malik, Igor J. et al. “Surface Roughness of Si Wafers: Correlating AFM and Haze Measurements,” Semiconductor Silicon/1994: Seventh International Symposium on Silicon Materials Science and Technology, ed. H.R. Huff, W. Bergholz and K. Sumino, The Electroche.
Marx, Egon et al. “Power spectral densities: A multiple technique study of different Si wafer surfaces,” J. Vac. Sci. Technol. B 20(1), Jan./Feb. 2002, pp. 31-41.
McMillan, Wayne; “Surfscan SP2: Enabling Cost-Effective Production and the 65nm Node and Beyond,” Yield Management Solutions, Summer 2004, pp. 14-23.
Nemoto et al. “Impact of Silicon Surface Roughness on Device Performance and Novel Roughness Measurement Method,” IEEE/SEMI Advanced Semiconductor Manufacturing Conference, 2007.
Scheer, B.W. “Development of a physical haze and microroughness standard,” SPIE vol. 2862, pp. 78-95 (1996).
Stover, John C. Optical Scattering: Measurement and Analysis, SPIE Optical Engineering Press, Bellingham, WA (1995).
U.S. Appl. No. 11/855,573 (Wu et al.) entitled Computer-Implemented Methods, Carrier Media, and Systems for Storing Image Data for a Wafer filed Sep. 14, 2007.
U.S. Appl. No. 11/855,581 (Wu et at) entitled Computer-Implemented Methods, Carrier Media, and Systems for Displaying an Image of At Least A Portion of a Wafer filed Sep. 14, 2007.
U.S. Appl. No. 60/868,769 (Fouquet et al.) entitled Methods, Designs, Defect Review Tools, and Systems for Locating Systematic Defects in A Defect Review Process filed Dec. 6, 2006.
U.S. Appl. No. 60/870,724 (Kulkarni et al.) entitled Methods and Systems for Creating Inspection Recipes Using Design Data filed Dec. 19, 2006.
U.S. Appl. No. 60/883,617 (Park et al.) entitled Methods and Systems for Using Device Information to Perform One or More Defect-Related Functions filed Jan. 5, 2007.
Written Opinion and International Search Report for PCT/US2009/051044, mailed Mar. 3, 2010.
U.S. Appl. No. 60/974,030 (Bhaskar et al.) entitled Systems and Methods for Creating Persistent Data for a Wafer and for Using Persistent Data for Inspection-Related Functions filed Sep. 20, 2007.
U.S. Appl. No. 61/074,065 (Chen et al.) entitled Computer-Implemented Methods, Computer-Readable Media, And Systems for Determining One Of More Characteristics of A Wafer filed Jun. 19, 2008.
U
Biellak Stephen
Kavaldjiev Daniel
Bui Bryan
KLA-Tencor Corp.
Mewherter Ann Marie
LandOfFree
Systems and methods for determining two or more... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems and methods for determining two or more..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for determining two or more... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2686366