Systems and methods for a wafer inspection system using...

Details Systems and methods for a wafer inspection system using... Systems and methods for a wafer inspection system using...

2007-05-15

2007-05-15

Pham, Hoa Q. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237500

Reexamination Certificate

active

11227555

ABSTRACT:
A method for detecting an anomaly on a top surface of a substrate comprises directing a first radiation beam having a first wavelength at the top surface of the substrate at a first angle measured from normal, and directing a second radiation beam having a second wavelength at the top surface of the substrate at a second angle measured from normal, wherein the second wavelength is not equal to the first wavelength. The method then comprises detecting scattered radiation from the first radiation beam and the second radiation beam to detect the presence of particles or COPs, and to differentiate between the two. Differences in the scattered radiation detected from the first radiation beam and from the second radiation beam provide the data needed to differentiate between particles and COPs.

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