Systems and methods for a memory and/or selection element...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S594000, C257SE27091, C257SE27095

Reexamination Certificate

active

10985172

ABSTRACT:
The subject invention provides systems and methodologies for fabrication of memory and/or selection (e.g., diodes) elements in a recession in a semiconductor layer. In particular, a trench of varying width is created in the semiconductor layer by employing various etching techniques. A metal film can be deposited in the trench according to a desired deposition thickness in order to seam close a narrow portion of the trench while form a dimple in a wide portion of the trench. The trench, after metal film deposition, exhibits a depression in wider trench portions relative to narrow trench portions. The depression can be utilized by placing one or more memory or selection layers in the depression, and a via can be formed over a portion of the trench to form an interconnect.

REFERENCES:
patent: 2002/0102839 (2002-08-01), Gonzalez et al.
patent: 2005/0184327 (2005-08-01), Ozawa

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