System to identify a wafer manufacturing problem and method...

Details System to identify a wafer manufacturing problem and method... System to identify a wafer manufacturing problem and method...

2005-04-26

2005-04-26

Tsai, Carol S. W. (Department: 2857)

Data processing: measuring, calibrating, or testing

Measurement system

Performance or efficiency evaluation

C382S149000, C382S145000, C702S035000

Reexamination Certificate

active

06885977

ABSTRACT:
A method (400) for determining a response to a wafer manufacturing process problem includes the steps of generating a wafer map signature (406) containing defect attributes to be identified and retrieving (410) one or more wafer map signatures from a database. The wafer map signature to be identified is matched (414) with the one or more wafer map signatures from the database in order to help find a root cause of a defect in a wafer manufacturing process.This provides at least the advantage that a signature matching capability allows an Operator to more accurately identify a root manufacturing cause of a wafer defect. Furthermore, instant feedback to the wafer manufacturing process can be provided to facilitate rapid correction of manufacturing errors.

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