System semiconductor device and method of manufacturing the...

Details System semiconductor device and method of manufacturing the... System semiconductor device and method of manufacturing the...

2007-11-20

2007-11-20

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S624000, C257SE23127

Reexamination Certificate

active

11103469

ABSTRACT:
A system semiconductor device includes a system LSI cell portion and a global wiring layer. The system LSI cell portion has a plurality of functional blocks for realizing specific functions on a semiconductor chip. The global wiring layer has a wiring layer on a semiconductor substrate. The system LSI cell portion is laminated with the global wiring layer.

REFERENCES:
patent: 4791609 (1988-12-01), Ito
patent: 5124273 (1992-06-01), Minami
patent: 5162240 (1992-11-01), Saitou et al.
patent: 5283081 (1994-02-01), Kata et al.
patent: 5300798 (1994-04-01), Yamazaki et al.
patent: 5430397 (1995-07-01), Itoh et al.
patent: 6278148 (2001-08-01), Watanabe et al.
patent: 64-74751 (1989-03-01), None
patent: 7-22587 (1995-01-01), None
patent: 7-86502 (1995-03-01), None
patent: 7-307434 (1995-11-01), None
patent: A 7-231050 (1996-08-01), None
patent: 10-173057 (1998-06-01), None
patent: 10-209317 (1998-08-01), None

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