System, method, and apparatus for electrically testing...

Details System, method, and apparatus for electrically testing... System, method, and apparatus for electrically testing...

2007-10-16

2007-10-16

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

Reexamination Certificate

active

10975273

ABSTRACT:
Built-in electrical test structures are measured for lead-to-lead shorting during the fabrication of MR elements on a wafer. The test structures are fabricated in the same fashion as the MR elements, however, the active sensor region or track width is omitted from the test structures. Thus, the left and right leads for each test structure are electrically isolated from each other in their “track width” region. If there is lead-to-lead shorting on a test structure, then the left and right leads are electrically connected in the track width region. A simple resistance measurement between the left and right leads determines the extent of any lead shorting by giving a quantitative resistance value.

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